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標題: IPC-9592 電腦與通信產業電源轉換裝置需求 [打印本頁]

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作者: hlperng    時間: 2012-5-1 13:33:31     標題: IPC-9592 電腦與通信產業電源轉換裝置需求



IPC所發行的《電腦與通信產業電源轉換裝置需求》(IPC 9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries)

• IPC 9592:2007 final draft (92頁)  (April, 2007)
• IPC 9592:2008 (93頁)  (September, 2008)
• IPC 9592A:2010 (132頁)  (May, 2010)
• IPC 9592B:2012 (126頁)  (November, 2012)
  

PCD: 電源轉換裝置(Power Converter Device)

BMP: 板裝電源(Board Mount Power)

• 第1類產品：內建在線路中的直流輸出電源供應單元，不論是輸入電源是交流電或直流電。(DC output power supplies to be embedded in equipment, wheter the input powr is AC or DC.)
• 第2類產品：板裝直流對直流轉換器，包括隔離式轉換器及非隔離式轉換器。 (Board mounted DC to DC converters including both isolated and nonisolated converters.)
• 第3類產品：由設備外部供電的交流對直流電源供應器，作為轉接器或充電器之用。(AC to DC power supplies used as adaptors and chargers that are external to the equipment being powered.)

2008年9月出版IPC 9592初版與2007年4月的最終草稿版有很大的差別，提供裝置供應者一些有關設計、鑑定、與生產試驗的實務，標準的章節包括：

• 第1節：範圍(scope)
• 第2節：引用文件、名詞與定義(applicable documents, terms and definitions)
• 第3節：產品規格與檔案需求(product specification and documentation requirements)
• 第4節：可靠度設計(design for reliability)
• 第5節：設計與鑑定試驗(design and qualification testing)
• 第6節：品質過程(quality processes)
• 第7節：製造符合試驗(manufacturing conformance testing)
• 附錄(appendix)
  

2008年初版有5個附錄：

• Appendix A: 減額定指南 (Derating Guidelines)
  AppendixA提供不錯的減額定資料，包括電容器(A-1)、電阻器(A-2)、二極體與電晶體(A-3)、磁性零件(A-4)、微電路與積體電路(A-5)、雜項電機與電子零件(A-6)
  附錄A-1：可靠度名詞與定義 (Appendix A-1: Reliability Terms and Definitions)
• 附錄B：典型詳細資料表 (Appendix B: Typical Comprehensive Data Sheets)
• 附錄C：功能測試需求 (Functional Test Requirements)
  附錄C-1：第1類 - 交流對直流、直流輸入電源供應單元(內建線路) (AC to DC and DC Input PSU)
  附錄C-2：第2類 - 板裝直流對直流轉換器 (Board Mounted DC to DC Converters)
  附錄C-3：第3類 - 交流對直流電源供應器或充電器 (AC to DC Power Supplies used as Adaptors and Chargers)
• 附錄D：應力試驗(高加速壽命試驗/高加速應力篩選/高加速應力稽核) (Appendix D: Stress Testing (HALT/HASS/HASA))
• 附錄E：製造可靠度試驗 (預燒/高加速應力篩選/出貨可靠度試驗) (Appendix E: Manufacturing Reliability Testing - BI/HASS/ORT)

2010年的IPC 9592A，章節架構與2008年初版大致相同，包括：

• 第1節：範圍(scope)
• 第2節：引用文件、名詞與定義(applicable documents, terms and definitions)
• 第3節：產品規格與檔案需求(product specification and documentation requirements)
• 第4節：可靠度設計(design for reliability)
• 第5節：設計與鑑定試驗(design and qualification testing)
• 第6節：品質過程(quality processes)
• 第7節：製造符合試驗(manufacturing conformance testing)
• 附錄(appendix)

2010年IPC 9592 A版改版重點：

• 減少「使用者與供應者雙方合意」之使用。(Reduction of the use of AABUS (As Agreed Between User and Supplier))
• 更明確的前處理試驗。(More definitive preconditioning tests) ⇐ 以耐濕性試驗或烘乾為主
• 濕度敏感度水準(MSLs)。(Moisture Sensitivity Levels) ⇐ 較深入詳細的第4.7節 (原為第4.6節)  (參考 http://redi.org.tw/wiki/index.php/濕度環境#濕度敏感度水準)
• 定義更好的腐蝕實務與試驗。(Better defined corrosion practices and tests)  ⇐ 新增4.3節，Metal Corrosion with PCD Electronic Assembly
• 高加速壽命試驗程序指引。(HALT Procedure Guidance) ⇐ 較深入詳細的第5.2.3節

除了原在5.4節應力試驗規定HALT(highly accelerated life test)之需求外，A版增加了HASS(highly accelerated stress screen)與HASA(highly accelerated screen audit)之建議及過程(7.3.2節與附錄D)，將HASS視為預燒(burn-in)的另一種更有效的選項方法。

IPC 9592:2007 final draft 可由IPC官方網站下載：
http://www.ipc.org/3.0_Industry/3.5_Councils_Associations/3.5.0_IPC/SPVC/0607/IPC-9592-Final-Draft-0407.pdf

IPC 9592 目錄(table of contents)可由IPC官方網站下載
http://www.ipc.org/TOC/IPC-9592:2008.pdf

IPC 9592A 目錄(table of contents)可由IPC官方網站下載：
http://www.ipc.org/TOC/IPC-9592A:2010.pdf

IPC 9592B 目錄(table of contents)可由IPC官方網站下載：
http://www.ipc.org/TOC/IPC-9592B:2012.pdf

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作者: hlperng    時間: 2013-4-6 07:32:11     標題: IPC 9592B: 2012年11月發佈



2012年11月，IPC又發佈IPC 9592 B版，除了更正A版一些排版上的問題之外，似乎沒有重大變更。
依照這幾年9592的出版狀況，IPC 9592:2008，IPC 9592A:2010，IPC 9592B:2012，可歸納出每兩年改版一次，或許可維持隨時更新的動力，表示這個產業領域的相關人員很重視共同標準的維持。

從IPC官方網站下載IPC 9592B目錄。

IPC 9592 第4章：可靠度設計，B版與A版目錄比較：

IPC 9592B:2012	IPC 9592A:2010	備註
4 Design for Reliability	4 Design for Reliability
4.1 Reliability Prediction (FIT)	4.1 Reliability Prediction (FIT)
4.2 Component Selection	4.2 Component Selection
4.3 Metal Corrosion with PCD Electronic Assembly	4.3 Metal Corrosion with PCD Electronic Assembly
4.4 Derating Guidelines	4.4 Derating Guidelines
4.5 Design Failure Modes and Effects Analysis (DFMEA)	4.5 Design Failure Modes and Effects Analysis (DFMEA)
4.6 Voltage Spacing Design Requirements	4.6 Voltage Spacing Design Requirements
4.7 Moisture Sensitivity Level (MSL) Rating of Surface Mount Power Conversion Devices (PCDs)	4.7 Moisture Sensitivity Level (MSL) Rating of Surface Mount Power Conversion Devices (PCDs)

IPC 9592B 第5章：設計驗證試驗，B版與A版目錄比較：

IPC 9592B:2012	IPC 9592A:2010	備註
5.1  Design Verification Testing (DVT)	5.1  Design Verification Testing (DVT)
5.1.6 Design Verification Testing - AC Input Parameters	5.1.6 Design Verification Testing - AC Input Parameters
5.1.7 Design Verification Testing - DC Input Parameters	5.1.7 Design Verification Testing - DC Input Parameters
5.1.8 Design Verification Testing - Overall Input to Output Parameters	5.1.8 Design Verification Testing - Overall Input to Output Parameters
5.1.9 Design Verification Testing - DC Output Parameters	5.1.9 Design Verification Testing - DC Output Parameters
5.1.10 Design Verification Testing - Protection Features	5.1.10 Design Verification Testing - Protection Features
5.1.11 Design Verification Testing - Input and Output Signals and Indicators	5.1.11 Design Verification Testing - Input and Output Signals and Indicators
5.1.12 Design Verification Testing - Other Electrical Parameters, Features and Functions	5.1.12 Design Verification Testing - Other Electrical Parameters, Features and Functions
5.1.13 Design Verification Testing - Hot Swap	5.1.12.2 Design Verification Testing - Hot Swap
5.1.14 Design Verification Testing - Mechanical Compliance	5.1.13 Design Verification Testing - Mechanical Compliance
5.2 Environmental Stress Testing (EST)	5.2 Environmental Stress Testing (EST)
5.2.3 Highly Accelerated Life Test (HALT)	5.2.3 Highly Accelerated Life Test (HALT)
5.2.4 Temperature, Humidity and Bias (THB)	5.2.4 Temperature, Humidity and Bias (THB)
5.2.5 High Temperature Operating Bias (HTOB)	5.2.5 High Temperature Operating Bias (HTOB)
5.2.6 Temperature Cycling Test	5.2.6 Temperature Cycling Test
5.2.7 Power and Temperature Cycling (PTC) Test	5.2.7 Power and Temperature Cycling (PTC) Test
5.2.8 Shock and Vibration	5.2.8 Shock and Vibration
5.2.9 Random Vibration - Operating	5.2.9 Random Vibration - Operating
5.2.10 Random Vibration - Non-Operating	5.2.10 Random Vibration - Nonoperating
5.2.11 Shock - Operating	5.2.11 Shock - Operating
5.2.12 Free Fall	5.2.12 Free Fall
5.2.13 Drop Test	5.2.13 Drop Test
5.2.14 Other Environmental Stress Testing	5.2.14 Other Environmental Stress Testing
5.2.14.1 Corrosion Resistance	5.2.14.1 Corrosion Resistance
5.2.14.2 Dust Resistance	5.2.14.2 Dust Resistance
5.2.14.3 SMT Attachment Reliability	5.2.14.3 SMT Attachment Reliability
5.2.14.4 Through Hole Pin Solderability	5.2.14.4 Through Hole Pin Solderability
5.3 Electromagnetic Susceptability (EMS) and Other Tests	5.3 Electromagnetic Susceptability (EMS) and Other Tests
5.3.1 Conducted Continuous Wave	5.3.1 Conducted Continuous Wave
5.3.2 Radiated Immunity	5.3.2 Radiated Immunity
5.3.3 Conducted Electrical Fast Transient (EFT)	5.3.3 Conducted Electrical Fast Transient (EFT)
5.3.4 Conducted Surges	5.3.4 Conducted Surges
5.3.5 Ring Waves	5.3.5 Ring Waves
5.3.6 Electrostatic Discharge - Packaged Power Devices	5.3.6 Electrostatic Discharge - Packaged Power Devices
5.3.7 Electrostatic Discharge - Board Mounted Power Devices	5.3.7 Electrostatic Discharge - Board Mounted Power Devices
5.3.8 Power Line Disturbance Immunity - AC Input	5.3.8 Power Line Disturbance Immunity
5.3.9 Electromagnetic Emmissions	5.3.9 Electromagnetic Emmissions
5.3.10 Acoustic Noise	5.3.10 Acoustic Noise
5.3.11 Product Safety	5.3.11 Product Safety
5.3.12 Regulatory "Green"	5.3.12 Regulatory "Green"

IPC 9592 第6章：品質過程，B版與A版目錄比較：

IPC 9592B:2012	IPC 9592A:2010	備註
6. Quality Processes	6. Quality Processes
6.1 Quality Management Systems	6.1 Quality Management Systems
6.1.1 Process Failure Modes and Effects Analysis (PFMEA)	6.1.1 Process Failure Modes and Effects Analysis (PFMEA)
6.1.2 Statistical Process Control	6.1.2 Statistical Process Control
6.1.3 Process Capability Assessment	6.1.3 Process Capability Assessment
6.1.4 Measurement Capability Assessment	6.1.4 Measurement Capability Assessment
6.1.5 Corrective Action Process	6.1.5 Corrective Action Process
6.1.6 Calibration	6.1.6 Calibration
6.1.7 Continuous Improvement	6.1.7 Continuous Improvement
6.1.8 Process Quality Metrics	6.1.8 Process Quality Metrics
6.2 Sub-Tier Supplier	6.2 Sub-Tier Supplier
6.3 Materiala Traceability Requirements	6.3 Materiala Traceability Requirements
6.4 Change Authorization	6.4 Change Authorization
6.5 Qualification of Change	6.5 Qualification of Change

IPC 9592 第7章：製造符合性試驗，B版與A版目錄比較：

IPC 9592B:2012	IPC 9592A:2010	備註
7 Manufacturing Conformance Testing	7 Manufacturing Conformance Testing
7.1 Manufacturing Conformance Tests	7.1 Manufacturing Conformance Tests
7.2  Early Manufacturing Conformance Test Requirements	7.2  Early Manufacturing Conformance Test Requirements
7.3 Final Assembly Test Requirements	7.3 Final Assembly Test Requirements
7.3.1 Functional Tests	7.3.1 Functional Tests
7.3.2 Stress Tests (Short Term Reliability Tests - BI/HASS)	7.3.2 Stress Tests (Short Term Reliability Tests - BI/HASS)
7.3.3 Ongoing Reliability Testing (ORT)	7.3.3 Ongoing Reliability Testing (ORT)
7.3.4 Safety Tests	7.3.4 Safety Tests
7.3.5 Final QA Cosmetic / Mechanical Audit	7.3.5 Final QA Cosmetic / Mechanical Audit
7.3.5.1 QA Out of Box Audit (OBA)	7.3.5.1 QA Out of Box Audit (OBA)

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作者: hlperng    時間: 2013-4-7 09:17:22     標題: IPC 9592有關驗證試驗名詞與定義

• BMP: 板裝電源
  Board Mount Power: Refers to encapsulated and open PWB power converters that are mounted on larger PWBs.
• DVT: 設計驗證試驗   
  5.1 Design Verification Test: A qualification test to assess if design specifications are met.
• EDVT: 電性設計驗證試驗
  Electrical Design Verification Test: A qualification test assess if electrical design specifications are met.
• EST: 環境應力試驗
  5.2 Environmental Stress Testing. The purpose of the environmental stress testing is to demonstrate a minimum ability of the product to withstand steady-state and changing temperature, humidity, input power and output loading without damage or degradation.
• HALT: 高加速壽命試驗
  5.2.3 Highly Accelerated Life Test: Design test used to improve the robustness/reliabililty of a product through test-fail-fix process where applied stresses are beyond the specified operating limits.
• THB: 溫度濕度偏壓
  5.2.4 Temperature Humidity Bias
  

• HTOB: 高溫操作偏壓
  5.2.5 High Temperature Operating Bias
• TC: 溫度循環試驗
  5.2.6 Temperature Cycling (TC) Test
• PTC: 功率與溫度循環試驗
  5.2.7 Power and Temperature Cycling (PTC) Test
• 操作隨機振動
  5.2.9 Random Vibration - Operating
• 不操作隨機振動
  5.2.10 Random Vibration - Nonoperating
• 操作衝擊
  5.2.11 Shock - Operating
• 自由落下
  5.2.12 Free Fall
• 跌落試驗
  5.2.13 Drop Test
• 耐蝕性
  5.2.14.1 Corrosion Resistance
• 耐塵性
  5.2.14.2 Dust Resistance
• 表面黏著技術附著可靠度
  5.2.14.3 SMT Attachment Reliabiilty
• 穿孔針腳可銲性
  5.2.14.4 Through Hole Pin Solderability
  

• Life Test: 壽命試驗
• ORT: 出貨可靠度試驗
  7.3.3 Outgoing Reliability Test:
  E.2.3 Ongoing Reliability Test (ORT) Requirements
• OBA: 品保開箱稽核
  7.3.5.1 QA Out of Box Audit
• STRIFE: 應力壽命試驗
  Stress+Life Test. Design test used to improve the robustness/reliability of a product through test-fail-fix process where applied stresses are beyond the specified operating limits (also, see HALT).
• HALT: 高加速壽命試驗
  D.1 Highly Accelerated Life Testing
• HASS/HASA 高加速應力篩選與高速加速應力稽核
  D.2 Highly Accelerated Stress Screening; HASS Audit.  Highly Accelerated Stress Screening: Used to improve the robustness/reliability of a product through test-fail-fix process where the applied stresses may be beyond the specified operating limits (OL) determined by HALT.  This is applied to 100 % of the manufactured units. Highly Accelerated Stress Screening Audit: Performed via sample testing as opposed to 100 % that is done with HASS.
  E.2.2 Highly Accelerated Stress Screening (HASS) Requirements
• E.2.2.3 HASS Audit (HASA)
• BI: 燒入
  E.2.1 Burn-In (BI) Requirements
  

Table A-1-1: MTBF, AFR, 與FIT之間的轉換關係

MTBF	AFR	AFR	FIT
hours	% def/yr 10[sup]-2[/sup]	ppm/yr 10[sup]-6[/sup]	fr/10[sup]9[/sup]hrs 10[sup]-9[/sup]
1,752,000	0.5	5,000	571
876,000	1.0	10,000	1,142
436,000	2.0	20,000	2,283
219,000	4.0	40,000	4,566
= 10[sup]9[/sup]/FIT	= 876,000/MTBF	= 87.6/MTBF	= 10[sup]9[/sup]/MTBF

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