The Sherlock automated design analysis software is capable of providing a comprehensive assessment
of early stage circuit card design and its ability to meet quality, reliability, and durability expectations.
This assessment consists of a number of validated techniques, including physics-of-failure (PoF) based
prediction that takes into consideration the use environment and the required lifetime. PoF modeling is a
science-based approach that analyzes the loads and stresses in an application and evaluates the ability
of materials to endure them from a strength and mechanics of material point of view. The wearout
lifetime prediction will include a level of detail that provides the ability to understand the contributing
factors and make targeted improvements.
The analyzes that this software is capable of performing include:
1. Plated through hole (PTH) lifetime
2. Risk of conductive anodic filament (CAF) formation
3. Solder joint lifetime under thermal cycling
4. Solder joint lifetime under vibration
5. Risk of interconnect failure during mechanical shock
6. Mean time between failure (MTBF) calculation 作者: function 時間: 2012-6-25 11:40:28